Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431504 | Method of manufacturing semiconductor devices by bonding a semiconductor disk on a base substrate, composite wafer and semiconductor device | Rudolf Berger, Albert Birner, Helmut Brech, Oliver Häberlen, Guenther Ruhl +1 more | 2019-10-01 |