Issued Patents 2019
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10390531 | Materials incorporating light actuated fluoroazobenzenes | Matthew S. Doyle, Jeffrey N. Judd, Joseph Kuczynski, Scott D. Strand | 2019-08-27 |
| 10396050 | Chip alignment utilizing superomniphobic surface treatment of silicon die | Eric J. Campbell, Sarah K. Czaplewski, Joseph Kuczynski | 2019-08-27 |
| 10392452 | Light generating microcapsules for self-healing polymer applications | Eric J. Campbell, Sarah K. Czaplewski, Joseph Kuczynski | 2019-08-27 |
| 10383216 | Tamper detection circuits | Matthew S. Doyle, Joseph Kuczynski, Kevin M. O'Connell, Chelsie M. Peterson, Mark D. Plucinski | 2019-08-13 |
| 10357921 | Light generating microcapsules for photo-curing | Eric J. Campbell, Sarah K. Czaplewski, Joseph Kuczynski | 2019-07-23 |
| 10328535 | Self-heating solder flux material | Eric J. Campbell, Sarah K. Czaplewski, Joseph Kuczynski | 2019-06-25 |
| 10334741 | Conductive polymers within drilled holes of printed circuit boards | Joseph Kuczynski, Jeffrey N. Judd, Matthew S. Doyle, Scott D. Strand | 2019-06-25 |
| 10309901 | Water-sensitive fluorophores for moisture content evaluation in hygroscopic polymers | Eric J. Campbell, Sarah K. Czaplewski, Joseph Kuczynski | 2019-06-04 |
| 10309692 | Self-heating thermal interface material | Eric J. Campbell, Joseph Kuczynski, Kevin A. Splittstoesser | 2019-06-04 |
| 10299366 | Tamper detection circuits | Matthew S. Doyle, Joseph Kuczynski, Kevin M. O'Connell, Chelsie M. Peterson, Mark. D. Plucinski | 2019-05-21 |
| 10285282 | Conductive polymers within drilled holes of printed circuit boards | Joseph Kuczynski, Jeffrey N. Judd, Matthew S. Doyle, Scott D. Strand | 2019-05-07 |
| 10285283 | Heating of printed circuit board core during laminate cure | Eric J. Campbell, Joseph Kuczynski | 2019-05-07 |
| 10278284 | Laminate materials with embedded heat-generating multi-compartment microcapsules | Eric J. Campbell, Joseph Kuczynski | 2019-04-30 |
| 10253157 | Shape memory thermal interface materials | Joseph Kuczynski, Kevin M. O'Connell, Chelsie M. Peterson, Mark D. Plucinski | 2019-04-09 |
| 10249578 | Core-shell particles for anti-tampering applications | Eric J. Campbell, Sarah K. Czaplewski, Joseph Kuczynski, Jason T. Wertz, Jing Zhang | 2019-04-02 |
| 10229292 | Tamper resistant electronic devices | Eric J. Campbell, Sarah K. Czaplewski, Joseph Kuczynski | 2019-03-12 |
| 10212812 | Composite materials including filled hollow glass filaments | Matthew S. Doyle, Joseph Kuczynski | 2019-02-19 |
| 10169499 | Thermoset resin flow models for printed circuit board laminates | Joseph Kuczynski, Arvind K. Sinha, Kevin A. Splittstoesser | 2019-01-01 |
| 10171498 | Secure crypto module including electrical shorting security layers | Gerald K. Bartley, Darryl J. Becker, Matthew S. Doyle, Joseph Kuczynski | 2019-01-01 |
| 10167397 | Method to determine connector metal wear via fluorescence | Eric J. Campbell, Sarah K. Czaplewski, Joseph Kuczynski | 2019-01-01 |