Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10390439 | Insertion loss reduction and increased bonding in a circuit apparatus | Brian L. Carlson, John R. Dangler, Roger S. Krabbenhoft | 2019-08-20 |
| 10309692 | Self-heating thermal interface material | Eric J. Campbell, Joseph Kuczynski, Timothy J. Tofil | 2019-06-04 |
| 10169499 | Thermoset resin flow models for printed circuit board laminates | Joseph Kuczynski, Arvind K. Sinha, Timothy J. Tofil | 2019-01-01 |