PC

Phillip F. Chapman

IBM: 1 patents #5,496 of 11,143Top 50%
📍 Colchester, VT: #10 of 26 inventorsTop 40%
🗺 Vermont: #189 of 496 inventorsTop 40%
Overall (2019): #312,723 of 560,194Top 60%
1
Patents 2019

Issued Patents 2019

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10170476 Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry David S. Collins, Steven H. Voldman 2019-01-01