Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10170476 | Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry | Phillip F. Chapman, Steven H. Voldman | 2019-01-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10170476 | Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry | Phillip F. Chapman, Steven H. Voldman | 2019-01-01 |