Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10256186 | Interconnect structure having subtractive etch feature and damascene feature | Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Elbert E. Huang, Naftali E. Lustig | 2019-04-09 |
| 10229875 | Stacked via structure for metal fuse applications | Griselda Bonilla, Kaushik Chanda, Ronald G. Filippi, Stephan Grunow, Naftali E. Lustig +1 more | 2019-03-12 |
| 10224236 | Forming air gap | Samuel S. Choi, Ronald G. Filippi, Elbert E. Huang, Naftali E. Lustig, Griselda Bonilla | 2019-03-05 |
| 10177031 | Subtractive etch interconnects | Junjing Bao, Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig | 2019-01-08 |
| 10177091 | Interconnect structure and method of forming | Chih-Chao Yang | 2019-01-08 |