Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10177069 | Heat-dissipating structure and semiconductor module using same | Takashi Naito, Motomune Kodama, Takuya Aoyagi, Shigeru Kikuchi, Takashi Nogawa +6 more | 2019-01-08 |
AM
Akihiro Miyauchi — 1 Patent in 2019
Overall (2019): #553,807 of 560,194Top 100%
1
Patents 2019