Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10280349 | 1K UV and thermal cure high temperature debondable adhesive | Stephen Hynes, Jiangbo Ouyang, John G. Woods, Bahram Issari, Shengqian Kong +2 more | 2019-05-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10280349 | 1K UV and thermal cure high temperature debondable adhesive | Stephen Hynes, Jiangbo Ouyang, John G. Woods, Bahram Issari, Shengqian Kong +2 more | 2019-05-07 |