Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10392543 | Reactive resins and formulations for low refractive index and low dielectric constant applications | Bahram Issari, Wenhua Zhang, John G. Woods, Shengqian Kong, Yayun Liu +1 more | 2019-08-27 |
| 10280349 | 1K UV and thermal cure high temperature debondable adhesive | Stephen Hynes, Chunyu Sun, John G. Woods, Bahram Issari, Shengqian Kong +2 more | 2019-05-07 |