Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10500402 | Hermetically sealed feedthrough with co-fired filled via and conductive insert for an active implantable medical device | Robert A. Stevenson, Xiaohong Tang, William C. Thiebolt, Christine A. Frysz, Keith W. Seitz +4 more | 2019-12-10 |
| 10449375 | Hermetic terminal for an AIMD having a pin joint in a feedthrough capacitor or circuit board | Dominick J. Frustaci, Keith W. Seitz, Thomas Marzano, Robert A. Stevenson, Christine A. Frysz +1 more | 2019-10-22 |
| RE47624 | Co-fired hermetically sealed feedthrough with alumina substrate and platinum filled via for an active implantable medical device | Xiaohong Tang, William C. Thiebolt, Christine A. Frysz, Keith W. Seitz, Robert A. Stevenson +4 more | 2019-10-01 |
| 10272252 | Hermetic terminal for an AIMD having a composite brazed conductive lead | Keith W. Seitz, Thomas Marzano, Robert A. Stevenson, Christine A. Frysz, Jason Woods +1 more | 2019-04-30 |
| 10272253 | Hermetic terminal for an active implantable medical device with composite co-fired filled via and body fluid side brazed leadwire | Keith W. Seitz, Thomas Marzano, Robert A. Stevenson, Christine A. Frysz, Jason Woods | 2019-04-30 |
| 10249415 | Process for manufacturing a leadless feedthrough for an active implantable medical device | Keith W. Seitz, Dallas J. Rensel, Brian P. Hohl, Jonathan Calamel, Xiaohong Tang +4 more | 2019-04-02 |