Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10500402 | Hermetically sealed feedthrough with co-fired filled via and conductive insert for an active implantable medical device | Robert A. Stevenson, Xiaohong Tang, William C. Thiebolt, Christine A. Frysz, Richard L. Brendel +4 more | 2019-12-10 |
| 10449375 | Hermetic terminal for an AIMD having a pin joint in a feedthrough capacitor or circuit board | Dominick J. Frustaci, Thomas Marzano, Robert A. Stevenson, Christine A. Frysz, Richard L. Brendel +1 more | 2019-10-22 |
| RE47624 | Co-fired hermetically sealed feedthrough with alumina substrate and platinum filled via for an active implantable medical device | Xiaohong Tang, William C. Thiebolt, Christine A. Frysz, Robert A. Stevenson, Richard L. Brendel +4 more | 2019-10-01 |
| 10420949 | Method of manufacturing a feedthrough insulator for an active implantable medical device incorporating a post conductive paste filled pressing step | Thomas Marzano, Robert A. Stevenson, Christine A. Frysz, Dallas J. Rensel, Brian P. Hohl | 2019-09-24 |
| 10272253 | Hermetic terminal for an active implantable medical device with composite co-fired filled via and body fluid side brazed leadwire | Thomas Marzano, Robert A. Stevenson, Christine A. Frysz, Jason Woods, Richard L. Brendel | 2019-04-30 |
| 10272252 | Hermetic terminal for an AIMD having a composite brazed conductive lead | Thomas Marzano, Robert A. Stevenson, Christine A. Frysz, Jason Woods, Richard L. Brendel +1 more | 2019-04-30 |
| 10249415 | Process for manufacturing a leadless feedthrough for an active implantable medical device | Dallas J. Rensel, Brian P. Hohl, Jonathan Calamel, Xiaohong Tang, Robert A. Stevenson +4 more | 2019-04-02 |