Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515920 | High bandwidth memory package for high performance processors | Woon-Seong Kwon, Nam Hoon Kim | 2019-12-24 |
| 10468359 | Package stiffener for protecting semiconductor die | William Frank Edwards, Erick Tuttle, Madhusudan K. Iyengar, Yuan Li, Jorge Padilla +1 more | 2019-11-05 |
| 10257921 | Embedded air gap transmission lines | Richard Stuart Roy, Pierre-Luc Cantin, Woon-Seong Kwon | 2019-04-09 |