Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10349187 | Acoustic sensor integrated MEMS microphone structure and fabrication method thereof | Junkai Zhan, Mengjin Cai, Guanxun Qiu, Zonglin Zhou | 2019-07-09 |
| 10277968 | Microphone with dustproof through holes | Guanxun Qiu | 2019-04-30 |
| 10246323 | Cavity forming method for a sensor chip, manufacturing method thereof, chip and electronics apparatus | Mengjin Cai | 2019-04-02 |
| 10177055 | Packaging structure of integrated sensor | Luyu Duanmu, Junde Zhang | 2019-01-08 |