Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10442961 | Composition, process for producing sheet, sheet, laminate, and laminate with device wafer | Ichiro KOYAMA, Yu Iwai, Atsushi Nakamura, Mitsuru Sawano | 2019-10-15 |
| 10414951 | Temporary bonding material, laminate, method for manufacturing laminate, method for manufacturing device substrate, and method for manufacturing semiconductor device | Kei FUKUHARA, Mitsuru Sawano | 2019-09-17 |
| 10287458 | Laminate for treatment of a wafer device, temporary adhesion composition, and temporary adhesion film | Yu Iwai, Mitsuru Sawano, Ichiro KOYAMA, Atsushi Nakamura | 2019-05-14 |