Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10414951 | Temporary bonding material, laminate, method for manufacturing laminate, method for manufacturing device substrate, and method for manufacturing semiconductor device | Yoshitaka Kamochi, Mitsuru Sawano | 2019-09-17 |