Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522394 | Method of creating aligned vias in ultra-high density integrated circuits | Min She | 2019-12-31 |
| 10431574 | Methods and systems for packaging semiconductor devices to improve yield | Winston Lee | 2019-10-01 |
| 10319727 | Fabricating memory devices with optimized gate oxide thickness | Winston Lee, Peter Wung Lee | 2019-06-11 |
| 10217669 | Isolation components for transistors formed on fin features of semiconductor substrates | Chuan-Cheng Cheng | 2019-02-26 |