Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522394 | Method of creating aligned vias in ultra-high density integrated circuits | Runzi Chang | 2019-12-31 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522394 | Method of creating aligned vias in ultra-high density integrated circuits | Runzi Chang | 2019-12-31 |