Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10410996 | Integrated circuit package for assembling various dice in a single IC package | Melvin Martin, Baltazar Canete, Macario Campos | 2019-09-10 |
| 10396004 | Reduction of cross talk in WLCSP's through laser drilled technique | Habeeb Mohiuddin Mohammed | 2019-08-27 |