Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10410996 | Integrated circuit package for assembling various dice in a single IC package | Melvin Martin, Macario Campos, Rajesh Subraya Aiyandra | 2019-09-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10410996 | Integrated circuit package for assembling various dice in a single IC package | Melvin Martin, Macario Campos, Rajesh Subraya Aiyandra | 2019-09-10 |