Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10373870 | Semiconductor device and method of packaging | Timothy L. Olson | 2019-08-06 |
| 10373902 | Fully molded miniaturized semiconductor module | Timothy L. Olson | 2019-08-06 |
| 10373913 | Method of marking a semiconductor package | — | 2019-08-06 |