Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10373870 | Semiconductor device and method of packaging | Christopher M. Scanlan | 2019-08-06 |
| 10373902 | Fully molded miniaturized semiconductor module | Christopher M. Scanlan | 2019-08-06 |