Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483229 | Sintering device | Frank Osterwald, Martin Becker, Lars Paulsen, Jacek Rudzki, Holger Ulrich | 2019-11-19 |
| 10438924 | Method for cohesively connecting a first component of a power semiconductor module to a second component of a power semiconductor module | Martin Becker, Frank Osterwald, Jacek Rudzki, Holger Ulrich | 2019-10-08 |
| 10403566 | Power module | Frank Osterwald | 2019-09-03 |
| 10381283 | Power semiconductor module | Frank Osterwald, Holger Ulrich | 2019-08-13 |
| 10332858 | Electronic sandwich structure with two parts joined together by means of a sintering layer | Martin Becker, Jacek Rudzki, Frank Osterwald | 2019-06-25 |
| 10306800 | Cooling trough, cooler and power module assembly | Franke Wulf-Toke, Reiner Hinken, Frank Osterwald, Klaus Olesen, Lars Paulsen | 2019-05-28 |