Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483229 | Sintering device | Frank Osterwald, Ronald Eisele, Martin Becker, Lars Paulsen, Holger Ulrich | 2019-11-19 |
| 10438924 | Method for cohesively connecting a first component of a power semiconductor module to a second component of a power semiconductor module | Martin Becker, Ronald Eisele, Frank Osterwald, Holger Ulrich | 2019-10-08 |
| 10332858 | Electronic sandwich structure with two parts joined together by means of a sintering layer | Martin Becker, Ronald Eisele, Frank Osterwald | 2019-06-25 |