Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510576 | Carrier-bonding methods and articles for semiconductor and interposer processing | Darwin Gene Enicks, John Tyler Keech, Windsor Pipes Thomas, III | 2019-12-17 |
| 10435796 | Work piece including a sacrificial cover layer for laser drilling substrates | Jeffrey John Domey, John Tyler Keech, Xinghua Li, Garrett Andrew Piech, Paul John Shustack +1 more | 2019-10-08 |
| 10366904 | Articles having holes with morphology attributes and methods for fabricating the same | Andres Covarrubias Jaramillo, Yuhui Jin, Frank Andrew Kramer, IV, Ekaterina Aleksandrovna Kuksenkova, Daniel Wayne Levesque, JR. +2 more | 2019-07-30 |