DJ

Daniel Wayne Levesque, JR.

CI Corning Incorporated: 2 patents #105 of 584Top 20%
Overall (2019): #180,283 of 560,194Top 35%
2
Patents 2019

Issued Patents 2019

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
10424606 Systems and methods for reducing substrate surface disruption during via formation Sean Matthew Garner, Robert George Manley, Garrett Andrew Piech, Rajesh Vaddi, Heather Nicole Vanselous 2019-09-24
10366904 Articles having holes with morphology attributes and methods for fabricating the same Andres Covarrubias Jaramillo, Yuhui Jin, Frank Andrew Kramer, IV, Ekaterina Aleksandrovna Kuksenkova, Garrett Andrew Piech +2 more 2019-07-30