Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497609 | Method for direct bonding of substrates including thinning of the edges of at least one of the two substrates | Christophe Morales, Hubert Moriceau, Francois Rieutord | 2019-12-03 |
| 10438921 | Method for direct bonding with self-alignment using ultrasound | Xavier Baillin, Severine Cheramy, Patrick Leduc, Loic Sanchez | 2019-10-08 |