Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497609 | Method for direct bonding of substrates including thinning of the edges of at least one of the two substrates | Frank Fournel, Christophe Morales, Hubert Moriceau | 2019-12-03 |