Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10319628 | Integrated circuit having a plurality of active layers and method of fabricating the same | Fabien Deprat, Perrine Batude, Laurent Brunet, Maud Vinet | 2019-06-11 |
| 10199276 | Semiconductor and metal alloy interconnections for a 3D circuit | Fabrice Nemouchi | 2019-02-05 |