| #280 |
Dhiraj D. Ballal |
Juniper Networks |
3 |
| #280 |
Jehn-Huar Chern |
Kla-Tencor |
3 |
| #280 |
Amogh Mahapatra |
Apple |
3 |
| #280 |
Jialei Xu |
Texas Instruments |
3 |
| #280 |
Hilmi Enes Egilmez |
Qualcomm |
3 |
| #280 |
Amip J. Shah |
HP |
3 |
| #280 |
Michael Le |
Broadcom |
3 |
| #280 |
Bencherki Mebarki |
Applied Materials |
3 |
| #280 |
Yikai Chen |
Applied Materials |
3 |
| #280 |
Rushin Shah |
Apple |
3 |
| #280 |
Terry Bluck |
Intevac |
3 |
| #280 |
Chenxi Liu |
Adobe |
3 |
| #280 |
Khadijeh Bayat |
Apple |
3 |
| #280 |
Vinayak Dangui |
Stanford University |
3 |
| #280 |
Varun Singh |
Texas Instruments |
3 |
| #280 |
Chandrashekar Mantha |
Arevo |
3 |
| #280 |
Mark A. Petrie |
Sri International |
3 |
| #280 |
Vinod Mitulal |
Cisco |
3 |
| #280 |
Umesh S. Vaishampayan |
Apple |
3 |
| #280 |
Ramanathan Lakshmikanthan |
Ericsson |
3 |
| #280 |
Weihuang Wang |
Cavium, Llc. |
3 |
| #280 |
Biao He |
University of California |
3 |
| #280 |
Anshul Sadana |
Arista Networks |
3 |
| #280 |
Arnold M. Escano |
Endovascular Technologies |
3 |
| #280 |
Anshuman Sahu |
Hitachi |
3 |
| #280 |
Andrzej T. Baranski |
Apple |
3 |
| #280 |
Jiayi Wu |
Arista Networks |
3 |
| #280 |
Ye Yin |
Meta |
3 |
| #280 |
Kanji Uchino |
Fujitsu Limited |
3 |
| #280 |
Xiaohan Ma |
— |
3 |
| #280 |
Clifford Drowley |
Semiconductor Manufacturing International (Shanghai) |
3 |
| #280 |
Miljenko Modric |
Glo Ab |
3 |
| #280 |
David Eberhart |
Integenx |
3 |
| #280 |
Lee W. Howes |
AMD |
3 |
| #280 |
Miguel Rodriguez |
AMD |
3 |
| #280 |
Philip A. Weaver |
Unl Holdings |
3 |
| #280 |
Sergiy Lozovsky |
— |
3 |
| #280 |
Mark Campbell |
Sicpa Holding Sa |
3 |
| #280 |
Firooz Nasser-Faili |
Rfhic |
3 |
| #280 |
Bhaskar P. Sarma |
Apple |
3 |
| #280 |
Syyean Hwu Gastelum |
Samsung |
3 |
| #280 |
Paul A. Baker |
Apple |
3 |
| #280 |
Mohammad Hadi Motieian Najar |
Texas Instruments |
3 |
| #280 |
Ko-Chung Tseng |
Goke Us Research Laboratory |
3 |
| #280 |
Jack Erdozain, Jr. |
Amazon |
3 |
| #280 |
Andrew Platzer |
Apple |
3 |
| #280 |
King Yi Heung |
Applied Materials |
3 |
| #280 |
Antonio Arion Gellineau |
Kla-Tencor |
3 |
| #280 |
Sandeep T. Nirmale |
Netapp |
3 |
| #280 |
Venkatuday M. Balabhadrapatruni |
IBM |
3 |