Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504862 | Redistribution metal and under bump metal interconnect structures and method | Liming Tsau, Edward Law, Andy Brotman | 2019-12-10 |
| 10276403 | High density redistribution layer (RDL) interconnect bridge using a reconstituted wafer | Rezaur Rahman Khan | 2019-04-30 |