Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504862 | Redistribution metal and under bump metal interconnect structures and method | Sam Ziqun Zhao, Liming Tsau, Andy Brotman | 2019-12-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504862 | Redistribution metal and under bump metal interconnect structures and method | Sam Ziqun Zhao, Liming Tsau, Andy Brotman | 2019-12-10 |