Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10347807 | Packaging photon building blocks with top side connections and interconnect structure | — | 2019-07-09 |
| 10325890 | Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate | Tao Tong, Mike Kwon, Michael Solomensky | 2019-06-18 |
| 10297731 | Light emitting diode constructions and methods for making the same | Vladimir Odnoblyudov | 2019-05-21 |