Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10325890 | Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate | R. Scott West, Tao Tong, Mike Kwon | 2019-06-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10325890 | Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate | R. Scott West, Tao Tong, Mike Kwon | 2019-06-18 |