Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10323015 | Leveler, leveler composition and method for electrodeposition of metals in microelectronics | Tao Ma, Peipei Dong, Zifang Zhu, Chen Chen | 2019-06-18 |
| 10315927 | Methods and processes of preparing aluminum hydroxide and aluminum oxide | Bing Zhao, Yinsheng Wang, Jinshan Zhang | 2019-06-11 |
| 10221496 | Copper filling of through silicon vias | Thomas B. Richardson, Wenbo Shao, Xuan Lin, Cai Wang, Vincent Paneccasio, Jr. +3 more | 2019-03-05 |