Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10519557 | Leveler compositions for use in copper deposition in manufacture of microelectronics | Kyle Whitten, Thomas B. Richardson, Ivan Li | 2019-12-31 |
| 10294574 | Levelers for copper deposition in microelectronics | Kyle Whitten, Thomas B. Richardson, Eric Rouya | 2019-05-21 |
| 10221496 | Copper filling of through silicon vias | Thomas B. Richardson, Wenbo Shao, Xuan Lin, Cai Wang, Joseph A. Abys +3 more | 2019-03-05 |