Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10211072 | Method of reconstituted substrate formation for advanced packaging applications | Han-Wen Chen, Steven Verhaverbeke, Roman Gouk, Guan Huei See, Yu Gu +3 more | 2019-02-19 |