Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10409358 | Multi-chip module package compact thermal models | Vamsi Krishna Yaddanapudi, Ankit R. Adhiya, Aniket Kulkarni | 2019-09-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10409358 | Multi-chip module package compact thermal models | Vamsi Krishna Yaddanapudi, Ankit R. Adhiya, Aniket Kulkarni | 2019-09-10 |