Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10409358 | Multi-chip module package compact thermal models | Vamsi Krishna Yaddanapudi, Ankit R. Adhiya, Manoj Nagulapally | 2019-09-10 |
| 10379893 | Container synchronization | Todd Matters, Dan Moulding, Sash Sunkara, Mikhail Zhidko | 2019-08-13 |