SL

Shoa-Siong Raymond Lim

AP Advanpack Solutions Pte: 1 patents #1 of 2Top 50%
📍 Singapore, SG: #448 of 1,836 inventorsTop 25%
Overall (2019): #273,189 of 560,194Top 50%
1
Patents 2019

Issued Patents 2019

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10446457 Multi-layer substrate for semiconductor packaging Hwee-Seng Jimmy Chew 2019-10-15