Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446457 | Multi-layer substrate for semiconductor packaging | Shoa-Siong Raymond Lim | 2019-10-15 |
| 10431477 | Method of packaging chip and chip package structure | — | 2019-10-01 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446457 | Multi-layer substrate for semiconductor packaging | Shoa-Siong Raymond Lim | 2019-10-15 |
| 10431477 | Method of packaging chip and chip package structure | — | 2019-10-01 |