Issued Patents 2019
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515889 | Semiconductor package device and method of manufacturing the same | — | 2019-12-24 |
| 10510705 | Semiconductor package structure having a second encapsulant extending in a cavity defined by a first encapsulant | — | 2019-12-17 |
| 10497657 | Semiconductor package device and method of manufacturing the same | — | 2019-12-03 |
| 10461005 | Semiconductor package | — | 2019-10-29 |
| 10446325 | Capacitor structures | Chi-Chang Lee | 2019-10-15 |
| 10438885 | Semiconductor device package and method of manufacturing the same | — | 2019-10-08 |
| 10424539 | Wiring structure, semiconductor package structure and semiconductor process | Ching Kuo Hsu | 2019-09-24 |
| 10420211 | Semiconductor package device | — | 2019-09-17 |
| 10418314 | External connection pad for semiconductor device package | — | 2019-09-17 |
| 10418316 | Semiconductor substrate, semiconductor package structure and method of manufacturing a semiconductor device | — | 2019-09-17 |
| 10388598 | Interposer, semiconductor package structure, and semiconductor process | Min-Lung Huang | 2019-08-20 |
| 10381161 | Capacitor structure | Chi-Chang Lee | 2019-08-13 |
| 10276480 | Semiconductor structure | — | 2019-04-30 |
| 10269672 | Semiconductor package device and method of manufacturing the same | Jen-Kuang Fang | 2019-04-23 |
| 10224301 | Semiconductor package device and method of manufacturing the same | Jen-Kuang Fang | 2019-03-05 |
| 10217712 | Semiconductor package and semiconductor process for manufacturing the same | — | 2019-02-26 |