Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9947605 | Flip chip cavity package | Saravuth Sirinorakul | 2018-04-17 |
| 9899208 | Molded leadframe substrate semiconductor package | Saravuth Sirinorakul | 2018-02-20 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9947605 | Flip chip cavity package | Saravuth Sirinorakul | 2018-04-17 |
| 9899208 | Molded leadframe substrate semiconductor package | Saravuth Sirinorakul | 2018-02-20 |