Issued Patents 2018
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163658 | Semiconductor package with multiple molding routing layers and a method of manufacturing the same | Suebphong Yenrudee | 2018-12-25 |
| 10096490 | Semiconductor package with multiple molding routing layers and a method of manufacturing the same | Suebphong Yenrudee | 2018-10-09 |
| 10032645 | Semiconductor package with multiple molding routing layers and a method of manufacturing the same | Suebphong Yenrudee | 2018-07-24 |
| 9972563 | Plated terminals with routing interconnections semiconductor device | — | 2018-05-15 |
| 9947605 | Flip chip cavity package | Somchai Nondhasitthichai | 2018-04-17 |
| 9922914 | Plated terminals with routing interconnections semiconductor device | — | 2018-03-20 |
| 9922913 | Plated terminals with routing interconnections semiconductor device | — | 2018-03-20 |
| 9922843 | Semiconductor package with multiple molding routing layers and a method of manufacturing the same | Suebphong Yenrudee | 2018-03-20 |
| 9917038 | Semiconductor package with multiple molding routing layers and a method of manufacturing the same | Suebphong Yenrudee | 2018-03-13 |
| 9899208 | Molded leadframe substrate semiconductor package | Somchai Nondhasitthichai | 2018-02-20 |