Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10153252 | Wafer to wafer structure and method of fabricating the same | — | 2018-12-11 |
| 9978666 | Method for fabrication semiconductor device with through-substrate via | Kuei-Sheng Wu | 2018-05-22 |