Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10153231 | Interconnect structure and fabrication method thereof | Hung-Miao Lin, Chun-Ling Lin, Ying-Lien Chen, Huei-Ru Tsai, Sheng-Yi Su | 2018-12-11 |
| 10079177 | Method for forming copper material over substrate | Ying-Lien Chen, Chun-Ling Lin, Huei-Ru Tsai, Hung-Miao Lin, Sheng-Yi Su +1 more | 2018-09-18 |
| 9966425 | Method for fabricating a MIM capacitor | Jen-Po Huang, Chin-Fu Lin, Bin-Siang Tsai, Xu Yang Shen, Seng-Wah Liau +6 more | 2018-05-08 |