Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10153231 | Interconnect structure and fabrication method thereof | Ko-Wei Lin, Chun-Ling Lin, Ying-Lien Chen, Huei-Ru Tsai, Sheng-Yi Su | 2018-12-11 |
| 10079177 | Method for forming copper material over substrate | Ko-Wei Lin, Ying-Lien Chen, Chun-Ling Lin, Huei-Ru Tsai, Sheng-Yi Su +1 more | 2018-09-18 |