Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10079143 | Method of forming semiconductor device having wick structure | Chun-Wei Yu, Chueh-Yang Liu, Yu-Ren Wang | 2018-09-18 |
| 9966266 | Apparatus for semiconductor wafer treatment and semiconductor wafer treatment | Yu-Ying Lin, Chueh-Yang Liu, Yu-Ren Wang, Chun-Wei Yu, Kuang-Hsiu Chen +2 more | 2018-05-08 |