Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10065407 | Systems and methods for separation of thermal interface bond | Lawrence A. Kyle, Corey Dean Hartman | 2018-09-04 |
| 9886067 | Systems and methods for tool-less board to board coupling | Raymond D. Heistand, II, Yen-Lin Wang, Kuang Hsi Lin | 2018-02-06 |