Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10087072 | Microelectromechanical system structure including thermal stability layer whose material has higher growth temperature, and method for fabricating the same | Chang-Sheng Hsu, Chia-Wei Lee, En-Chan Chen, Shih-Wei Li | 2018-10-02 |