Issued Patents 2018
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109556 | Systems and methods for spring-based device attachment | Masao Noguchi | 2018-10-23 |
| 10083917 | Power electronics assemblies and vehicles incorporating the same | Yanghe Liu, Ercan Mehmet Dede | 2018-09-25 |
| 10082047 | Rapid warm-up schemes of engine and engine coolant for higher fuel efficiency | Ercan Mehmet Dede | 2018-09-25 |
| 10043731 | Multi-step processes for high temperature bonding and bonded substrates formed therefrom | Masao Noguchi | 2018-08-07 |
| 10032694 | Power electronics assemblies having a semiconductor cooling chip and an integrated fluid channel system | Yuji Fukuoka, Ercan Mehmet Dede, Feng Zhou | 2018-07-24 |
| 10020243 | Power electronics assemblies having a wide bandgap semiconductor device and an integrated fluid channel system | Yuji Fukuoka, Ercan Mehmet Dede, Feng Zhou | 2018-07-10 |
| 9974208 | Pool boiling system | Ercan Mehmet Dede | 2018-05-15 |
| 9903664 | Jet impingement cooling apparatuses having non-uniform jet orifice sizes | — | 2018-02-27 |
| 9905532 | Methods and apparatuses for high temperature bonding and bonded substrates having variable porosity distribution formed therefrom | Masao Noguchi | 2018-02-27 |